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(module "15mm_base" (layer "F.Cu") (tedit 5F85D84C)
(attr through_hole)
(fp_text reference "REF**" (at 0 -0.5 unlocked) (layer "F.SilkS") hide
(effects (font (size 1 1) (thickness 0.15)))
(tstamp d88a69e0-e882-4322-98af-8dd6c4a04bd8)
)
(fp_text value "15mm_base" (at 0 1 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 05c5e1c2-16a0-4daa-b5f1-98e541a9dff9)
)
(fp_rect (start -7.5 0.8) (end 7.5 -0.8) (layer "Dwgs.User") (width 0.1) (tstamp e98e64a7-8ee6-4c13-a24e-e75747946705))
(pad "1" smd rect (at -5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 58d79d73-23a4-4191-8c47-693348589b85))
(pad "2" smd rect (at -2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp d0f438a4-9083-4be9-a0ce-50f4f092f575))
(pad "3" smd rect (at 0 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 0e351b3a-b0d6-4c7f-97ce-5d0268e7a4c3))
(pad "4" smd rect (at 2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 433daf92-890e-4890-946e-fc43aa195002))
(pad "5" smd rect (at 5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 76d50f2e-c4e5-45f8-802c-cc3097f36d2b))
(pad "6" smd rect (at 5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 35f23b6b-8228-4704-9c16-5736f53b6d03))
(pad "7" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 5b43be6d-7192-4238-be67-8b6751632eab))
(pad "8" smd rect (at 0 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp fc439a78-d516-4626-b594-728b4589cccd))
(pad "9" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp e865c403-31c6-4515-8fc3-cf6f9d063233))
(pad "10" smd rect (at -5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp d0989164-7061-4909-b62d-b2fcb68c5eea))
(pad "11" smd rect (at -5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp 18de01ae-13ef-4ef2-becc-fa0494f8a87e))
(pad "12" smd rect (at -2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp 33788947-80fe-42e6-8e47-75c4b8eec42c))
(pad "13" smd rect (at 0 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp 6853ebce-42c9-46c2-a413-7176c55f237a))
(pad "14" smd rect (at 2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp 35d4b9e8-0cee-41c4-bb10-1d3eaa4d17bd))
(pad "15" smd rect (at 5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp a2cd4699-a646-4c27-81f9-6c21c36243cf))
(pad "16" smd rect (at 5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp 9df40f1a-5ea5-4397-a1a8-29c4bae55a33))
(pad "17" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp c7d88e90-bba4-4129-ab2c-06efc4610c03))
(pad "18" smd rect (at 0 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp 785e8283-7533-431c-b1f4-d56f5bafe36b))
(pad "19" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp ba3a3762-d747-46fe-9d8f-937c86e9f2e9))
(pad "20" smd rect (at -5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
(solder_mask_margin 0.1) (tstamp d6af0cf8-74b8-43e3-bd68-5a2b55de7a46))
)
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