(module "15mm_base" (layer "F.Cu") (tedit 5F85D84C)
  (attr through_hole)
  (fp_text reference "REF**" (at 0 -0.5 unlocked) (layer "F.SilkS") hide
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp d88a69e0-e882-4322-98af-8dd6c4a04bd8)
  )
  (fp_text value "15mm_base" (at 0 1 unlocked) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 05c5e1c2-16a0-4daa-b5f1-98e541a9dff9)
  )
  (fp_rect (start -7.5 0.8) (end 7.5 -0.8) (layer "Dwgs.User") (width 0.1) (tstamp e98e64a7-8ee6-4c13-a24e-e75747946705))
  (pad "1" smd rect (at -5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 58d79d73-23a4-4191-8c47-693348589b85))
  (pad "2" smd rect (at -2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp d0f438a4-9083-4be9-a0ce-50f4f092f575))
  (pad "3" smd rect (at 0 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 0e351b3a-b0d6-4c7f-97ce-5d0268e7a4c3))
  (pad "4" smd rect (at 2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 433daf92-890e-4890-946e-fc43aa195002))
  (pad "5" smd rect (at 5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 76d50f2e-c4e5-45f8-802c-cc3097f36d2b))
  (pad "6" smd rect (at 5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 35f23b6b-8228-4704-9c16-5736f53b6d03))
  (pad "7" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 5b43be6d-7192-4238-be67-8b6751632eab))
  (pad "8" smd rect (at 0 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp fc439a78-d516-4626-b594-728b4589cccd))
  (pad "9" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp e865c403-31c6-4515-8fc3-cf6f9d063233))
  (pad "10" smd rect (at -5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp d0989164-7061-4909-b62d-b2fcb68c5eea))
  (pad "11" smd rect (at -5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 18de01ae-13ef-4ef2-becc-fa0494f8a87e))
  (pad "12" smd rect (at -2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 33788947-80fe-42e6-8e47-75c4b8eec42c))
  (pad "13" smd rect (at 0 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 6853ebce-42c9-46c2-a413-7176c55f237a))
  (pad "14" smd rect (at 2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 35d4b9e8-0cee-41c4-bb10-1d3eaa4d17bd))
  (pad "15" smd rect (at 5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp a2cd4699-a646-4c27-81f9-6c21c36243cf))
  (pad "16" smd rect (at 5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 9df40f1a-5ea5-4397-a1a8-29c4bae55a33))
  (pad "17" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp c7d88e90-bba4-4129-ab2c-06efc4610c03))
  (pad "18" smd rect (at 0 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 785e8283-7533-431c-b1f4-d56f5bafe36b))
  (pad "19" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp ba3a3762-d747-46fe-9d8f-937c86e9f2e9))
  (pad "20" smd rect (at -5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp d6af0cf8-74b8-43e3-bd68-5a2b55de7a46))
)