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authorjaseg <git@jaseg.net>2019-10-28 15:03:24 +0100
committerjaseg <git@jaseg.net>2019-10-28 15:03:24 +0100
commit81979f66465c72bf34abc3060991e6bda66d4d4b (patch)
treef57069f7e2b77c48128eb69535c072db3f33a7c2 /remote.pro
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usb-remote-81979f66465c72bf34abc3060991e6bda66d4d4b.tar.bz2
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Initial commit
Diffstat (limited to 'remote.pro')
-rw-r--r--remote.pro286
1 files changed, 286 insertions, 0 deletions
diff --git a/remote.pro b/remote.pro
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--- /dev/null
+++ b/remote.pro
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+update=Mon Oct 28 15:02:27 2019
+version=1
+last_client=kicad
+[general]
+version=1
+RootSch=
+BoardNm=
+[cvpcb]
+version=1
+NetIExt=net
+[eeschema]
+version=1
+LibDir=
+[eeschema/libraries]
+[pcbnew]
+version=1
+PageLayoutDescrFile=
+LastNetListRead=
+LastSTEPExportPath=
+LastIDFExportPath=
+LastVRMLExportPath=
+LastSpecctraDSNExportPath=
+LastGenCADExportPath=
+CopperLayerCount=2
+BoardThickness=1.6
+AllowMicroVias=0
+AllowBlindVias=0
+RequireCourtyardDefinitions=0
+ProhibitOverlappingCourtyards=1
+MinTrackWidth=0.2
+MinViaDiameter=0.4
+MinViaDrill=0.3
+MinMicroViaDiameter=0.2
+MinMicroViaDrill=0.09999999999999999
+MinHoleToHole=0.25
+CopperEdgeClearance=0.01
+TrackWidth1=0.25
+TrackWidth2=0.2
+TrackWidth3=0.3
+TrackWidth4=0.5
+TrackWidth5=0.8
+TrackWidth6=1.2
+TrackWidth7=1.8
+TrackWidth8=2.8
+ViaDiameter1=0.8
+ViaDrill1=0.4
+ViaDiameter2=0.6
+ViaDrill2=0.3
+ViaDiameter3=0.8
+ViaDrill3=0.4
+ViaDiameter4=1.2
+ViaDrill4=0.6
+ViaDiameter5=2
+ViaDrill5=1
+dPairWidth1=0.2
+dPairGap1=0.25
+dPairViaGap1=0.25
+SilkLineWidth=0.12
+SilkTextSizeV=1
+SilkTextSizeH=1
+SilkTextSizeThickness=0.15
+SilkTextItalic=0
+SilkTextUpright=1
+CopperLineWidth=0.2
+CopperTextSizeV=1.5
+CopperTextSizeH=1.5
+CopperTextThickness=0.3
+CopperTextItalic=0
+CopperTextUpright=1
+EdgeCutLineWidth=0.05
+CourtyardLineWidth=0.05
+OthersLineWidth=0.09999999999999999
+OthersTextSizeV=1
+OthersTextSizeH=1
+OthersTextSizeThickness=0.15
+OthersTextItalic=0
+OthersTextUpright=1
+SolderMaskClearance=0.051
+SolderMaskMinWidth=0.25
+SolderPasteClearance=0
+SolderPasteRatio=-0
+[pcbnew/Layer.F.Cu]
+Name=F.Cu
+Type=0
+Enabled=1
+[pcbnew/Layer.In1.Cu]
+Name=In1.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In2.Cu]
+Name=In2.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In3.Cu]
+Name=In3.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In4.Cu]
+Name=In4.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In5.Cu]
+Name=In5.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In6.Cu]
+Name=In6.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In7.Cu]
+Name=In7.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In8.Cu]
+Name=In8.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In9.Cu]
+Name=In9.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In10.Cu]
+Name=In10.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In11.Cu]
+Name=In11.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In12.Cu]
+Name=In12.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In13.Cu]
+Name=In13.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In14.Cu]
+Name=In14.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In15.Cu]
+Name=In15.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In16.Cu]
+Name=In16.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In17.Cu]
+Name=In17.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In18.Cu]
+Name=In18.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In19.Cu]
+Name=In19.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In20.Cu]
+Name=In20.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In21.Cu]
+Name=In21.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In22.Cu]
+Name=In22.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In23.Cu]
+Name=In23.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In24.Cu]
+Name=In24.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In25.Cu]
+Name=In25.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In26.Cu]
+Name=In26.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In27.Cu]
+Name=In27.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In28.Cu]
+Name=In28.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In29.Cu]
+Name=In29.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.In30.Cu]
+Name=In30.Cu
+Type=0
+Enabled=0
+[pcbnew/Layer.B.Cu]
+Name=B.Cu
+Type=0
+Enabled=1
+[pcbnew/Layer.B.Adhes]
+Enabled=1
+[pcbnew/Layer.F.Adhes]
+Enabled=1
+[pcbnew/Layer.B.Paste]
+Enabled=1
+[pcbnew/Layer.F.Paste]
+Enabled=1
+[pcbnew/Layer.B.SilkS]
+Enabled=1
+[pcbnew/Layer.F.SilkS]
+Enabled=1
+[pcbnew/Layer.B.Mask]
+Enabled=1
+[pcbnew/Layer.F.Mask]
+Enabled=1
+[pcbnew/Layer.Dwgs.User]
+Enabled=1
+[pcbnew/Layer.Cmts.User]
+Enabled=1
+[pcbnew/Layer.Eco1.User]
+Enabled=1
+[pcbnew/Layer.Eco2.User]
+Enabled=1
+[pcbnew/Layer.Edge.Cuts]
+Enabled=1
+[pcbnew/Layer.Margin]
+Enabled=1
+[pcbnew/Layer.B.CrtYd]
+Enabled=1
+[pcbnew/Layer.F.CrtYd]
+Enabled=1
+[pcbnew/Layer.B.Fab]
+Enabled=1
+[pcbnew/Layer.F.Fab]
+Enabled=1
+[pcbnew/Layer.Rescue]
+Enabled=0
+[pcbnew/Netclasses]
+[pcbnew/Netclasses/Default]
+Name=Default
+Clearance=0.125
+TrackWidth=0.25
+ViaDiameter=0.8
+ViaDrill=0.4
+uViaDiameter=0.3
+uViaDrill=0.1
+dPairWidth=0.2
+dPairGap=0.25
+dPairViaGap=0.25
+[pcbnew/Netclasses/1]
+Name=bus
+Clearance=0.2
+TrackWidth=0.25
+ViaDiameter=0.8
+ViaDrill=0.4
+uViaDiameter=0.3
+uViaDrill=0.1
+dPairWidth=0.2
+dPairGap=0.25
+dPairViaGap=0.25
+[schematic_editor]
+version=1
+PageLayoutDescrFile=
+PlotDirectoryName=
+SubpartIdSeparator=0
+SubpartFirstId=65
+NetFmtName=
+SpiceAjustPassiveValues=0
+LabSize=50
+ERC_WriteFile=0
+ERC_TestSimilarLabels=1
+ERC_CheckUniqueGlobalLabels=1
+ERC_CheckBusDriverConflicts=1
+ERC_CheckBusEntryConflicts=1
+ERC_CheckBusToBusConflicts=1
+ERC_CheckBusToNetConflicts=1