diff options
Diffstat (limited to 'hw1/hw1.kicad_pcb')
| -rw-r--r-- | hw1/hw1.kicad_pcb | 361 |
1 files changed, 222 insertions, 139 deletions
diff --git a/hw1/hw1.kicad_pcb b/hw1/hw1.kicad_pcb index abb5b61..9eecfec 100644 --- a/hw1/hw1.kicad_pcb +++ b/hw1/hw1.kicad_pcb @@ -1,15 +1,15 @@ (kicad_pcb (version 4) (host pcbnew 4.0.6) (general - (links 70) - (no_connects 70) + (links 71) + (no_connects 53) (area 110.922999 72.949999 179.653001 126.440001) (thickness 1.6) (drawings 27) - (tracks 0) + (tracks 84) (zones 0) (modules 25) - (nets 26) + (nets 25) ) (page A4) @@ -69,7 +69,7 @@ (pad_to_mask_clearance 0) (aux_axis_origin 110.998 126.365) (grid_origin 110.998 126.365) - (visible_elements FFFFFF7F) + (visible_elements FFFEFF7F) (pcbplotparams (layerselection 0x00030_80000001) (usegerberextensions false) @@ -121,8 +121,7 @@ (net 21 /UART_RX_OUT) (net 22 "Net-(JP1-Pad2)") (net 23 "Net-(JP2-Pad2)") - (net 24 "Net-(R1-Pad1)") - (net 25 "Net-(C6-Pad1)") + (net 24 /VLCD) (net_class Default "This is the default net class." (clearance 0.2) @@ -150,12 +149,11 @@ (add_net /UART_TX_OUT) (add_net /USB_DM) (add_net /USB_DP) + (add_net /VLCD) (add_net GND) - (add_net "Net-(C6-Pad1)") (add_net "Net-(JP1-Pad2)") (add_net "Net-(JP2-Pad2)") (add_net "Net-(P10-Pad6)") - (add_net "Net-(R1-Pad1)") ) (module Socket_Arduino_Uno:Socket_Strip_Arduino_1x08 locked (layer F.Cu) (tedit 552168D2) (tstamp 551AF9EA) @@ -385,18 +383,18 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 59F7BF21) - (at 144.399 100.076 180) + (at 152.019 109.093 270) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /58CF4B65) (attr smd) - (fp_text reference C1 (at 0 -1.25 180) (layer F.SilkS) + (fp_text reference C1 (at 0 -1.25 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value 100n (at 0 1.5 180) (layer F.Fab) + (fp_text value 100n (at 0 1.5 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text user %R (at 0 -1.25 180) (layer F.Fab) + (fp_text user %R (at 0 -1.25 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) @@ -409,9 +407,9 @@ (fp_line (start -1.8 -0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end 1.8 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) - (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (pad 1 smd rect (at -0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) (net 4 /NRST)) - (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (pad 2 smd rect (at 0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) (net 2 GND)) (model Capacitors_SMD.3dshapes/C_0603.wrl (at (xyz 0 0 0)) @@ -421,18 +419,18 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 59F7BF27) - (at 156.972 108.712 180) + (at 153.797 109.093 270) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /58CF43FF) (attr smd) - (fp_text reference C2 (at 0 -1.25 180) (layer F.SilkS) + (fp_text reference C2 (at 0 -1.25 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value 100n (at 0 1.5 180) (layer F.Fab) + (fp_text value 100n (at 0 1.5 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text user %R (at 0 -1.25 180) (layer F.Fab) + (fp_text user %R (at 0 -1.25 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) @@ -445,9 +443,9 @@ (fp_line (start -1.8 -0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end 1.8 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) - (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (pad 1 smd rect (at -0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) - (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (pad 2 smd rect (at 0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) (net 2 GND)) (model Capacitors_SMD.3dshapes/C_0603.wrl (at (xyz 0 0 0)) @@ -457,7 +455,7 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 59F7BF2D) - (at 144.399 101.981 180) + (at 144.272 103.759 180) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /58CF69A9) @@ -493,18 +491,18 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 59F7BF33) - (at 149.352 92.964) + (at 146.685 94.742 180) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /58CF69F1) (attr smd) - (fp_text reference C4 (at 0 -1.25) (layer F.SilkS) + (fp_text reference C4 (at 0 -1.25 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value 100n (at 0 1.5) (layer F.Fab) + (fp_text value 100n (at 0 1.5 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text user %R (at 0 -1.25) (layer F.Fab) + (fp_text user %R (at 0 -1.25 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) @@ -517,9 +515,9 @@ (fp_line (start -1.8 -0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end 1.8 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) - (pad 1 smd rect (at -0.95 0) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) - (pad 2 smd rect (at 0.95 0) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) (net 2 GND)) (model Capacitors_SMD.3dshapes/C_0603.wrl (at (xyz 0 0 0)) @@ -529,7 +527,7 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 59F7BF39) - (at 144.399 97.917) + (at 160.147 97.917) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /58CF6A3A) @@ -565,15 +563,15 @@ ) (module Connectors:USB_Micro-B (layer F.Cu) (tedit 5543E447) (tstamp 59F7BF54) - (at 176.784 109.601 90) + (at 113.03 90.932 270) (descr "Micro USB Type B Receptacle") (tags "USB USB_B USB_micro USB_OTG") (path /58CF10AD) (attr smd) - (fp_text reference P10 (at 0 -3.24 90) (layer F.SilkS) + (fp_text reference P10 (at 0 -3.24 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value CONTROL (at 0 5.01 90) (layer F.Fab) + (fp_text value CONTROL (at 0 5.01 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -4.6 -2.59) (end 4.6 -2.59) (layer F.CrtYd) (width 0.05)) @@ -585,34 +583,34 @@ (fp_line (start 4.35 -2.38) (end 4.35 4.03) (layer F.SilkS) (width 0.12)) (fp_line (start 4.35 2.8) (end -4.35 2.8) (layer F.SilkS) (width 0.12)) (fp_line (start -4.35 4.03) (end -4.35 -2.38) (layer F.SilkS) (width 0.12)) - (pad 1 smd rect (at -1.3 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) + (pad 1 smd rect (at -1.3 -1.35) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) (net 1 +5V)) - (pad 2 smd rect (at -0.65 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) + (pad 2 smd rect (at -0.65 -1.35) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) (net 12 /USB_DM)) - (pad 3 smd rect (at 0 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) + (pad 3 smd rect (at 0 -1.35) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) (net 13 /USB_DP)) - (pad 4 smd rect (at 0.65 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)) - (pad 5 smd rect (at 1.3 -1.35 180) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) + (pad 4 smd rect (at 0.65 -1.35) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask)) + (pad 5 smd rect (at 1.3 -1.35) (size 1.35 0.4) (layers F.Cu F.Paste F.Mask) (net 2 GND)) - (pad 6 thru_hole oval (at -2.5 -1.35 180) (size 0.95 1.25) (drill oval 0.55 0.85) (layers *.Cu *.Mask) + (pad 6 thru_hole oval (at -2.5 -1.35) (size 0.95 1.25) (drill oval 0.55 0.85) (layers *.Cu *.Mask) (net 14 "Net-(P10-Pad6)")) - (pad 6 thru_hole oval (at 2.5 -1.35 180) (size 0.95 1.25) (drill oval 0.55 0.85) (layers *.Cu *.Mask) + (pad 6 thru_hole oval (at 2.5 -1.35) (size 0.95 1.25) (drill oval 0.55 0.85) (layers *.Cu *.Mask) (net 14 "Net-(P10-Pad6)")) - (pad 6 thru_hole oval (at -3.5 1.35 180) (size 1.55 1) (drill oval 1.15 0.5) (layers *.Cu *.Mask) + (pad 6 thru_hole oval (at -3.5 1.35) (size 1.55 1) (drill oval 1.15 0.5) (layers *.Cu *.Mask) (net 14 "Net-(P10-Pad6)")) - (pad 6 thru_hole oval (at 3.5 1.35 180) (size 1.55 1) (drill oval 1.15 0.5) (layers *.Cu *.Mask) + (pad 6 thru_hole oval (at 3.5 1.35) (size 1.55 1) (drill oval 1.15 0.5) (layers *.Cu *.Mask) (net 14 "Net-(P10-Pad6)")) ) (module Pin_Headers:Pin_Header_Straight_1x06_Pitch2.54mm (layer F.Cu) (tedit 5862ED52) (tstamp 59F7C0DF) - (at 172.085 86.36) + (at 137.541 101.219 270) (descr "Through hole straight pin header, 1x06, 2.54mm pitch, single row") (tags "Through hole pin header THT 1x06 2.54mm single row") (path /59F7E088) - (fp_text reference J1 (at 0 -2.39) (layer F.SilkS) + (fp_text reference J1 (at 0 -2.39 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value CONN_01X06 (at 0 15.09) (layer F.Fab) + (fp_text value CONN_01X06 (at 0 15.09 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -1.27 -1.27) (end -1.27 13.97) (layer F.Fab) (width 0.1)) @@ -629,17 +627,17 @@ (fp_line (start -1.6 14.3) (end 1.6 14.3) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.6 14.3) (end 1.6 -1.6) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.6 -1.6) (end -1.6 -1.6) (layer F.CrtYd) (width 0.05)) - (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 1 thru_hole rect (at 0 0 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 3 +3V3)) - (pad 2 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 2 thru_hole oval (at 0 2.54 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 15 /SWCLK)) - (pad 3 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 3 thru_hole oval (at 0 5.08 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 2 GND)) - (pad 4 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 4 thru_hole oval (at 0 7.62 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 16 /SWDIO)) - (pad 5 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 5 thru_hole oval (at 0 10.16 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 4 /NRST)) - (pad 6 thru_hole oval (at 0 12.7) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 6 thru_hole oval (at 0 12.7 270) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 17 /SWO)) (model Pin_Headers.3dshapes/Pin_Header_Straight_1x06_Pitch2.54mm.wrl (at (xyz 0 -0.25 0)) @@ -649,18 +647,18 @@ ) (module Housings_QFP:TQFP-48_7x7mm_Pitch0.5mm (layer F.Cu) (tedit 54130A77) (tstamp 59F7C113) - (at 152.781 100.711) + (at 151.785 100.997 90) (descr "48 LEAD TQFP 7x7mm (see MICREL TQFP7x7-48LD-PL-1.pdf)") (tags "QFP 0.5") (path /58CEFE92) (attr smd) - (fp_text reference U1 (at 0 -6) (layer F.SilkS) + (fp_text reference U1 (at 0 -6 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value STM32L151C6TxA (at 0 6) (layer F.Fab) + (fp_text value STM32L151C6TxA (at 0 6 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text user %R (at 0 0) (layer F.Fab) + (fp_text user %R (at 0 0 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -2.5 -3.5) (end 3.5 -3.5) (layer F.Fab) (width 0.15)) @@ -681,79 +679,79 @@ (fp_line (start 3.625 3.625) (end 3.1 3.625) (layer F.SilkS) (width 0.15)) (fp_line (start 3.625 -3.625) (end 3.1 -3.625) (layer F.SilkS) (width 0.15)) (fp_line (start -3.625 -3.2) (end -5 -3.2) (layer F.SilkS) (width 0.15)) - (pad 1 smd rect (at -4.35 -2.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) - (net 25 "Net-(C6-Pad1)")) - (pad 2 smd rect (at -4.35 -2.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 3 smd rect (at -4.35 -1.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 4 smd rect (at -4.35 -1.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 5 smd rect (at -4.35 -0.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 6 smd rect (at -4.35 -0.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 7 smd rect (at -4.35 0.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 1 smd rect (at -4.35 -2.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (net 24 /VLCD)) + (pad 2 smd rect (at -4.35 -2.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 3 smd rect (at -4.35 -1.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 4 smd rect (at -4.35 -1.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 5 smd rect (at -4.35 -0.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 6 smd rect (at -4.35 -0.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 7 smd rect (at -4.35 0.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 4 /NRST)) - (pad 8 smd rect (at -4.35 0.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 8 smd rect (at -4.35 0.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 2 GND)) - (pad 9 smd rect (at -4.35 1.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 9 smd rect (at -4.35 1.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) - (pad 10 smd rect (at -4.35 1.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 11 smd rect (at -4.35 2.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 12 smd rect (at -4.35 2.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 10 smd rect (at -4.35 1.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 11 smd rect (at -4.35 2.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 12 smd rect (at -4.35 2.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 20 /UART_TX_OUT)) - (pad 13 smd rect (at -2.75 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 13 smd rect (at -2.75 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 21 /UART_RX_OUT)) - (pad 14 smd rect (at -2.25 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 14 smd rect (at -2.25 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 18 /DAC1_OUT)) - (pad 15 smd rect (at -1.75 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 15 smd rect (at -1.75 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 19 /DAC2_OUT)) - (pad 16 smd rect (at -1.25 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 16 smd rect (at -1.25 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 5 /ADC_IN1)) - (pad 17 smd rect (at -0.75 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 18 smd rect (at -0.25 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 19 smd rect (at 0.25 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 20 smd rect (at 0.75 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 21 smd rect (at 1.25 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 22 smd rect (at 1.75 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 23 smd rect (at 2.25 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 17 smd rect (at -0.75 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 18 smd rect (at -0.25 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 19 smd rect (at 0.25 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 20 smd rect (at 0.75 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 21 smd rect (at 1.25 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 22 smd rect (at 1.75 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 23 smd rect (at 2.25 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 2 GND)) - (pad 24 smd rect (at 2.75 4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 24 smd rect (at 2.75 4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) - (pad 25 smd rect (at 4.35 2.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 25 smd rect (at 4.35 2.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 8 /SPI_CS)) - (pad 26 smd rect (at 4.35 2.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 26 smd rect (at 4.35 2.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 11 /SPI_SCK)) - (pad 27 smd rect (at 4.35 1.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 27 smd rect (at 4.35 1.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 10 /SPI_MISO)) - (pad 28 smd rect (at 4.35 1.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 28 smd rect (at 4.35 1.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 9 /SPI_MOSI)) - (pad 29 smd rect (at 4.35 0.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 30 smd rect (at 4.35 0.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 31 smd rect (at 4.35 -0.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 32 smd rect (at 4.35 -0.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 29 smd rect (at 4.35 0.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 30 smd rect (at 4.35 0.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 31 smd rect (at 4.35 -0.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 32 smd rect (at 4.35 -0.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 12 /USB_DM)) - (pad 33 smd rect (at 4.35 -1.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 33 smd rect (at 4.35 -1.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 13 /USB_DP)) - (pad 34 smd rect (at 4.35 -1.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 34 smd rect (at 4.35 -1.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 16 /SWDIO)) - (pad 35 smd rect (at 4.35 -2.25) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 35 smd rect (at 4.35 -2.25 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 2 GND)) - (pad 36 smd rect (at 4.35 -2.75) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 36 smd rect (at 4.35 -2.75 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) - (pad 37 smd rect (at 2.75 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 37 smd rect (at 2.75 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 15 /SWCLK)) - (pad 38 smd rect (at 2.25 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 39 smd rect (at 1.75 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 38 smd rect (at 2.25 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 39 smd rect (at 1.75 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 17 /SWO)) - (pad 40 smd rect (at 1.25 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 41 smd rect (at 0.75 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 42 smd rect (at 0.25 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 43 smd rect (at -0.25 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 44 smd rect (at -0.75 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) - (pad 45 smd rect (at -1.25 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 40 smd rect (at 1.25 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 41 smd rect (at 0.75 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 42 smd rect (at 0.25 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 43 smd rect (at -0.25 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 44 smd rect (at -0.75 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask)) + (pad 45 smd rect (at -1.25 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 7 /I2C_SCL)) - (pad 46 smd rect (at -1.75 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 46 smd rect (at -1.75 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 6 /I2C_SDA)) - (pad 47 smd rect (at -2.25 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 47 smd rect (at -2.25 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 2 GND)) - (pad 48 smd rect (at -2.75 -4.35 90) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) + (pad 48 smd rect (at -2.75 -4.35 180) (size 1.3 0.25) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) (model Housings_QFP.3dshapes/TQFP-48_7x7mm_Pitch0.5mm.wrl (at (xyz 0 0 0)) @@ -763,14 +761,14 @@ ) (module Socket_Strips:Socket_Strip_Angled_2x05_Pitch2.54mm (layer F.Cu) (tedit 588DE958) (tstamp 5A0F5F85) - (at 117.348 105.41) + (at 173.228 104.013 180) (descr "Through hole angled socket strip, 2x05, 2.54mm pitch, 8.51mm socket length, double rows") (tags "Through hole angled socket strip THT 2x05 2.54mm double row") (path /58CF048F) - (fp_text reference P9 (at -5.65 -2.27) (layer F.SilkS) + (fp_text reference P9 (at -5.65 -2.27 180) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value FX2LA (at -5.65 12.43) (layer F.Fab) + (fp_text value FX2LA (at -5.65 12.43 180) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -4.06 -1.27) (end -4.06 1.27) (layer F.Fab) (width 0.1)) @@ -881,24 +879,24 @@ (fp_line (start 1.55 11.7) (end -12.85 11.7) (layer F.CrtYd) (width 0.05)) (fp_line (start -12.85 11.7) (end -12.85 -1.55) (layer F.CrtYd) (width 0.05)) (fp_line (start -12.85 -1.55) (end 1.55 -1.55) (layer F.CrtYd) (width 0.05)) - (pad 1 thru_hole rect (at 0 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 1 thru_hole rect (at 0 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 7 /I2C_SCL)) - (pad 2 thru_hole oval (at -2.54 0) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 2 thru_hole oval (at -2.54 0 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 6 /I2C_SDA)) - (pad 3 thru_hole oval (at 0 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 3 thru_hole oval (at 0 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 11 /SPI_SCK)) - (pad 4 thru_hole oval (at -2.54 2.54) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 4 thru_hole oval (at -2.54 2.54 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 10 /SPI_MISO)) - (pad 5 thru_hole oval (at 0 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 5 thru_hole oval (at 0 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 9 /SPI_MOSI)) - (pad 6 thru_hole oval (at -2.54 5.08) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 6 thru_hole oval (at -2.54 5.08 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 8 /SPI_CS)) - (pad 7 thru_hole oval (at 0 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 7 thru_hole oval (at 0 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 21 /UART_RX_OUT)) - (pad 8 thru_hole oval (at -2.54 7.62) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 8 thru_hole oval (at -2.54 7.62 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 20 /UART_TX_OUT)) - (pad 9 thru_hole oval (at 0 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)) - (pad 10 thru_hole oval (at -2.54 10.16) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) + (pad 9 thru_hole oval (at 0 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask)) + (pad 10 thru_hole oval (at -2.54 10.16 180) (size 1.7 1.7) (drill 1) (layers *.Cu *.Mask) (net 2 GND)) (model Socket_Strips.3dshapes/Socket_Strip_Angled_2x05_Pitch2.54mm.wrl (at (xyz -0.05 -0.2 0)) @@ -908,15 +906,15 @@ ) (module TO_SOT_Packages_SMD:SOT-23-5_HandSoldering (layer F.Cu) (tedit 583F3A3F) (tstamp 5A0F5F92) - (at 169.545 109.728 180) + (at 122.682 86.233 90) (descr "5-pin SOT23 package") (tags "SOT-23-5 hand-soldering") (path /59F7B611) (attr smd) - (fp_text reference U2 (at 0 -2.9 180) (layer F.SilkS) + (fp_text reference U2 (at 0 -2.9 90) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value MIC550x-3.3YM5 (at 0 2.9 180) (layer F.Fab) + (fp_text value MIC550x-3.3YM5 (at 0 2.9 90) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.9 1.61) (end 0.9 1.61) (layer F.SilkS) (width 0.12)) @@ -930,14 +928,14 @@ (fp_line (start -2.38 -1.8) (end -2.38 1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.38 1.8) (end 2.38 -1.8) (layer F.CrtYd) (width 0.05)) (fp_line (start 2.38 1.8) (end -2.38 1.8) (layer F.CrtYd) (width 0.05)) - (pad 1 smd rect (at -1.35 -0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) + (pad 1 smd rect (at -1.35 -0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) (net 1 +5V)) - (pad 2 smd rect (at -1.35 0 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) + (pad 2 smd rect (at -1.35 0 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) (net 2 GND)) - (pad 3 smd rect (at -1.35 0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) + (pad 3 smd rect (at -1.35 0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) (net 1 +5V)) - (pad 4 smd rect (at 1.35 0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)) - (pad 5 smd rect (at 1.35 -0.95 180) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) + (pad 4 smd rect (at 1.35 0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask)) + (pad 5 smd rect (at 1.35 -0.95 90) (size 1.56 0.65) (layers F.Cu F.Paste F.Mask) (net 3 +3V3)) (model TO_SOT_Packages_SMD.3dshapes\SOT-23-5.wrl (at (xyz 0 0 0)) @@ -947,7 +945,7 @@ ) (module Socket_Strips:Socket_Strip_Straight_2x01_Pitch2.54mm (layer F.Cu) (tedit 588DE958) (tstamp 5A0F6297) - (at 170.434 120.015 270) + (at 169.037 120.015 270) (descr "Through hole straight socket strip, 2x01, 2.54mm pitch, double rows") (tags "Through hole socket strip THT 2x01 2.54mm double row") (path /5A0F91B9) @@ -985,7 +983,7 @@ ) (module Socket_Strips:Socket_Strip_Straight_2x01_Pitch2.54mm (layer F.Cu) (tedit 588DE958) (tstamp 5A0F629D) - (at 173.482 120.015 270) + (at 172.339 120.015 270) (descr "Through hole straight socket strip, 2x01, 2.54mm pitch, double rows") (tags "Through hole socket strip THT 2x01 2.54mm double row") (path /5A0F9269) @@ -1023,7 +1021,7 @@ ) (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58AAD9E8) (tstamp 5A0F62A3) - (at 169.291 114.808) + (at 167.894 114.808) (descr "Resistor SMD 0603, hand soldering") (tags "resistor 0603") (path /5A0F8D14) @@ -1048,7 +1046,7 @@ (fp_line (start 1.95 0.7) (end 1.95 -0.7) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.95 0.7) (end -1.96 0.7) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask) - (net 24 "Net-(R1-Pad1)")) + (net 3 +3V3)) (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask) (net 22 "Net-(JP1-Pad2)")) (model Resistors_SMD.3dshapes/R_0603.wrl @@ -1059,7 +1057,7 @@ ) (module Resistors_SMD:R_0603_HandSoldering (layer F.Cu) (tedit 58AAD9E8) (tstamp 5A0F62A9) - (at 169.291 113.284) + (at 172.466 114.681) (descr "Resistor SMD 0603, hand soldering") (tags "resistor 0603") (path /5A0F8EF5) @@ -1084,7 +1082,7 @@ (fp_line (start 1.95 0.7) (end 1.95 -0.7) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.95 0.7) (end -1.96 0.7) (layer F.CrtYd) (width 0.05)) (pad 1 smd rect (at -1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask) - (net 24 "Net-(R1-Pad1)")) + (net 3 +3V3)) (pad 2 smd rect (at 1.1 0) (size 1.2 0.9) (layers F.Cu F.Paste F.Mask) (net 23 "Net-(JP2-Pad2)")) (model Resistors_SMD.3dshapes/R_0603.wrl @@ -1095,18 +1093,18 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 5A0F67DC) - (at 144.399 96.393 180) + (at 148.971 108.839 270) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /5A0FB867) (attr smd) - (fp_text reference C6 (at 0 -1.25 180) (layer F.SilkS) + (fp_text reference C6 (at 0 -1.25 270) (layer F.SilkS) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text value 100n (at 0 1.5 180) (layer F.Fab) + (fp_text value 100n (at 0 1.5 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) - (fp_text user %R (at 0 -1.25 180) (layer F.Fab) + (fp_text user %R (at 0 -1.25 270) (layer F.Fab) (effects (font (size 1 1) (thickness 0.15))) ) (fp_line (start -0.8 0.4) (end -0.8 -0.4) (layer F.Fab) (width 0.1)) @@ -1119,9 +1117,9 @@ (fp_line (start -1.8 -0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end 1.8 -0.65) (layer F.CrtYd) (width 0.05)) (fp_line (start 1.8 0.65) (end -1.8 0.65) (layer F.CrtYd) (width 0.05)) - (pad 1 smd rect (at -0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) - (net 25 "Net-(C6-Pad1)")) - (pad 2 smd rect (at 0.95 0 180) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (pad 1 smd rect (at -0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) + (net 24 /VLCD)) + (pad 2 smd rect (at 0.95 0 270) (size 1.2 0.75) (layers F.Cu F.Paste F.Mask) (net 2 GND)) (model Capacitors_SMD.3dshapes/C_0603.wrl (at (xyz 0 0 0)) @@ -1131,7 +1129,7 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 5A0F6D33) - (at 172.085 106.553) + (at 127.889 86.233) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /5A0FC76D) @@ -1167,7 +1165,7 @@ ) (module Capacitors_SMD:C_0603_HandSoldering (layer F.Cu) (tedit 58AA848B) (tstamp 5A0F6D39) - (at 167.513 106.68) + (at 124.079 81.661) (descr "Capacitor SMD 0603, hand soldering") (tags "capacitor 0603") (path /5A0FC660) @@ -1232,4 +1230,89 @@ (gr_line (start 120.523 82.55) (end 120.523 93.98) (angle 90) (layer Dwgs.User) (width 0.15)) (gr_line (start 104.648 82.55) (end 120.523 82.55) (angle 90) (layer Dwgs.User) (width 0.15)) + (segment (start 147.806 94.571) (end 147.635 94.742) (width 0.25) (layer F.Cu) (net 3) (tstamp 5A1191BA) (status 30)) + (segment (start 145.242 103.739) (end 145.222 103.759) (width 0.25) (layer F.Cu) (net 3) (tstamp 5A10BD95) (status 30)) + (segment (start 127.381 101.219) (end 127.381 104.648) (width 0.25) (layer B.Cu) (net 4)) + (segment (start 151.323 108.839) (end 152.019 108.143) (width 0.25) (layer F.Cu) (net 4) (tstamp 5A12126C)) + (segment (start 131.572 108.839) (end 151.323 108.839) (width 0.25) (layer F.Cu) (net 4) (tstamp 5A121267)) + (segment (start 127.381 104.648) (end 131.572 108.839) (width 0.25) (layer F.Cu) (net 4) (tstamp 5A121266)) + (via (at 127.381 104.648) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 4)) + (segment (start 152.019 108.143) (end 152.035 108.127) (width 0.25) (layer F.Cu) (net 4)) + (segment (start 152.035 108.127) (end 152.035 105.347) (width 0.25) (layer F.Cu) (net 4) (tstamp 5A121199)) + (segment (start 166.878 123.825) (end 162.687 119.634) (width 0.25) (layer F.Cu) (net 5)) + (segment (start 159.905 102.247) (end 156.135 102.247) (width 0.25) (layer F.Cu) (net 5) (tstamp 5A11F07C)) + (segment (start 162.687 105.029) (end 159.905 102.247) (width 0.25) (layer F.Cu) (net 5) (tstamp 5A11F074)) + (segment (start 162.687 119.634) (end 162.687 105.029) (width 0.25) (layer F.Cu) (net 5) (tstamp 5A11F06D)) + (segment (start 147.435 102.747) (end 149.229 102.747) (width 0.25) (layer F.Cu) (net 6)) + (segment (start 166.497 120.015) (end 169.037 120.015) (width 0.25) (layer B.Cu) (net 6) (tstamp 5A1212D3)) + (segment (start 149.606 103.124) (end 166.497 120.015) (width 0.25) (layer B.Cu) (net 6) (tstamp 5A1212D2)) + (via (at 149.606 103.124) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 6)) + (segment (start 149.229 102.747) (end 149.606 103.124) (width 0.25) (layer F.Cu) (net 6) (tstamp 5A1212CB)) + (segment (start 147.435 102.247) (end 150.126 102.247) (width 0.25) (layer F.Cu) (net 7)) + (segment (start 171.069 118.745) (end 172.339 120.015) (width 0.25) (layer B.Cu) (net 7) (tstamp 5A1212F0)) + (segment (start 166.624 118.745) (end 171.069 118.745) (width 0.25) (layer B.Cu) (net 7) (tstamp 5A1212E7)) + (segment (start 150.495 102.616) (end 166.624 118.745) (width 0.25) (layer B.Cu) (net 7) (tstamp 5A1212E6)) + (via (at 150.495 102.616) (size 0.6) (drill 0.4) (layers F.Cu B.Cu) (net 7)) + (segment (start 150.126 102.247) (end 150.495 102.616) 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