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author | Jan--Henrik <janhenrik@janhenrik.org> | 2019-10-17 01:14:43 +0200 |
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committer | Jan--Henrik <janhenrik@janhenrik.org> | 2019-10-17 01:14:43 +0200 |
commit | aedb40c6762c8b79bda5afb5685f843b147fc605 (patch) | |
tree | 7a2af76a1565c8d719e2c9cc6c76bdf5cfcb5e79 /OtterPill.pro | |
parent | e8ce69ccb5f72c80c06e9a2613a3428d060f9036 (diff) | |
download | minikbd-aedb40c6762c8b79bda5afb5685f843b147fc605.tar.gz minikbd-aedb40c6762c8b79bda5afb5685f843b147fc605.tar.bz2 minikbd-aedb40c6762c8b79bda5afb5685f843b147fc605.zip |
updated PCB and gerber
Diffstat (limited to 'OtterPill.pro')
-rw-r--r-- | OtterPill.pro | 181 |
1 files changed, 179 insertions, 2 deletions
diff --git a/OtterPill.pro b/OtterPill.pro index ce1d0a8..945a868 100644 --- a/OtterPill.pro +++ b/OtterPill.pro @@ -1,4 +1,4 @@ -update=Wed 01 May 2019 02:18:33 PM CEST +update=Wed 24 Jul 2019 10:05:41 AM CEST version=1 last_client=kicad [general] @@ -21,7 +21,7 @@ BoardThickness=1.6 AllowMicroVias=0 AllowBlindVias=0 RequireCourtyardDefinitions=0 -ProhibitOverlappingCourtyards=1 +ProhibitOverlappingCourtyards=0 MinTrackWidth=0.157 MinViaDiameter=0.4 MinViaDrill=0.3 @@ -65,7 +65,184 @@ SolderMaskClearance=0.051 SolderMaskMinWidth=0.25 SolderPasteClearance=0 SolderPasteRatio=-0 +[pcbnew/Layer.F.Cu] +Name=F.Cu +Type=0 +Enabled=1 +[pcbnew/Layer.In1.Cu] +Name=In1.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In2.Cu] +Name=In2.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In3.Cu] +Name=In3.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In4.Cu] +Name=In4.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In5.Cu] +Name=In5.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In6.Cu] +Name=In6.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In7.Cu] +Name=In7.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In8.Cu] +Name=In8.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In9.Cu] +Name=In9.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In10.Cu] +Name=In10.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In11.Cu] +Name=In11.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In12.Cu] +Name=In12.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In13.Cu] +Name=In13.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In14.Cu] +Name=In14.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In15.Cu] +Name=In15.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In16.Cu] +Name=In16.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In17.Cu] +Name=In17.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In18.Cu] +Name=In18.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In19.Cu] +Name=In19.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In20.Cu] +Name=In20.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In21.Cu] +Name=In21.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In22.Cu] +Name=In22.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In23.Cu] +Name=In23.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In24.Cu] +Name=In24.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In25.Cu] +Name=In25.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In26.Cu] +Name=In26.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In27.Cu] +Name=In27.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In28.Cu] +Name=In28.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In29.Cu] +Name=In29.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.In30.Cu] +Name=In30.Cu +Type=0 +Enabled=0 +[pcbnew/Layer.B.Cu] +Name=B.Cu +Type=0 +Enabled=1 +[pcbnew/Layer.B.Adhes] +Enabled=1 +[pcbnew/Layer.F.Adhes] +Enabled=1 +[pcbnew/Layer.B.Paste] +Enabled=1 +[pcbnew/Layer.F.Paste] +Enabled=1 +[pcbnew/Layer.B.SilkS] +Enabled=1 +[pcbnew/Layer.F.SilkS] +Enabled=1 +[pcbnew/Layer.B.Mask] +Enabled=1 +[pcbnew/Layer.F.Mask] +Enabled=1 +[pcbnew/Layer.Dwgs.User] +Enabled=1 +[pcbnew/Layer.Cmts.User] +Enabled=1 +[pcbnew/Layer.Eco1.User] +Enabled=1 +[pcbnew/Layer.Eco2.User] +Enabled=1 +[pcbnew/Layer.Edge.Cuts] +Enabled=1 +[pcbnew/Layer.Margin] +Enabled=1 +[pcbnew/Layer.B.CrtYd] +Enabled=1 +[pcbnew/Layer.F.CrtYd] +Enabled=1 +[pcbnew/Layer.B.Fab] +Enabled=1 +[pcbnew/Layer.F.Fab] +Enabled=1 +[pcbnew/Layer.Rescue] +Enabled=0 [pcbnew/Netclasses] +[pcbnew/Netclasses/Default] +Name=Default +Clearance=0.157 +TrackWidth=0.157 +ViaDiameter=0.6 +ViaDrill=0.3 +uViaDiameter=0.3 +uViaDrill=0.1 +dPairWidth=0.2 +dPairGap=0.25 +dPairViaGap=0.25 [pcbnew/Netclasses/1] Name=signal Clearance=0.157 |