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(module "15mm_base" (layer F.Cu) (tedit 5F75A762)
  (fp_text reference "REF**" (at 0 -0.5 unlocked) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 407e7717-1c07-4fc0-ac43-aa57380c24d7)
  )
  (fp_text value "15mm_base" (at 0 1 unlocked) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 6e5d68d9-2b6b-40e5-bc99-cfc119206e51)
  )
  (fp_rect (start -7.5 0.8) (end 7.5 -0.8) (layer Dwgs.User) (width 0.1) (tstamp acd5cbb4-d7d5-400f-b2ae-a99fd6822dd0))
  (pad "1" smd rect (at -5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 14adf9ad-b6bd-40da-82f2-2d6e94bec28c))
  (pad "2" smd rect (at -2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 296c8038-7d2c-4af5-b457-5e4defca5a53))
  (pad "3" smd rect (at 0 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 82e57846-cd01-458d-b1c3-544d1008bbf3))
  (pad "4" smd rect (at 2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 2a52e434-44e7-4e2d-9c90-593276f71ad9))
  (pad "5" smd rect (at 5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp bfecaa8b-5a47-4fc1-9372-5f6a59460d91))
  (pad "6" smd rect (at 5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 10c5f3e6-1d01-4e87-989c-e33024fffbfc))
  (pad "7" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 27e6f852-5174-4078-b90a-4b56fc11da51))
  (pad "8" smd rect (at 0 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp a93c3724-a9b8-47fe-9486-218cb83487d4))
  (pad "9" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 80e2663b-0e60-4399-be1d-e7b7dde1d5ff))
  (pad "10" smd rect (at -5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 87793d07-66b4-4b6a-becd-17930cb77bb6))
  (pad "11" smd rect (at -5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 0350a55c-a504-43bf-a7cf-85d4d5d75224))
  (pad "12" smd rect (at -2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 6b8b7d42-f8a3-41ac-99d2-f0942f0b5b1c))
  (pad "13" smd rect (at 0 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 9a563ad5-3473-4e51-aff9-70dc2c50019b))
  (pad "14" smd rect (at 2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 24f745bb-33f9-46cd-bba1-ed8e69ba6fc4))
  (pad "15" smd rect (at 5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 39428d2a-5b82-4f65-bfd7-0a595a150c4a))
  (pad "16" smd rect (at 5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp d65ba9ec-6797-4001-ae06-1fdae460f66d))
  (pad "17" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp c13deca2-6853-446d-a414-19242d852152))
  (pad "18" smd rect (at 0 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 640aad9b-ef00-48ad-9a70-522a90abbfc1))
  (pad "19" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp 189be20d-968f-4c84-8a31-392d3f3c6f56))
  (pad "20" smd rect (at -5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")
    (solder_mask_margin 0.1) (tstamp f92d91a7-789c-4460-a217-682318b445ce))
)