Merge remote-tracking branch 'wendelstein/master'

1 files changed, 0 insertions, 34 deletions

diff --git a/mech_pcbs/common/common_footprints.pretty/8mm_base.kicad_mod b/mech_pcbs/common/common_footprints.pretty/8mm_base.kicad_mod
deleted file mode 100644
index fb111f1..0000000
--- a/mech_pcbs/common/common_footprints.pretty/8mm_base.kicad_mod
+++ /dev/null
@@ -1,34 +0,0 @@
-(module "8mm_base" (layer F.Cu) (tedit 5F75A806)

-  (fp_text reference "REF**" (at 0 -0.5 unlocked) (layer F.SilkS)

-    (effects (font (size 1 1) (thickness 0.15)))

-    (tstamp 5a32de52-8d75-4520-9c49-1c6b3742cbe9)

-  )

-  (fp_text value "8mm_base" (at 0 1 unlocked) (layer F.Fab)

-    (effects (font (size 1 1) (thickness 0.15)))

-    (tstamp e7f16cdc-08ff-4f2b-9d3d-6439c09d596e)

-  )

-  (fp_rect (start 7.5 -0.8) (end -7.5 0.8) (layer F.SilkS) (width 0.12) (tstamp ec32adf5-9922-4a03-bae7-dc5ca1762975))

-  (fp_rect (start -4 0.8) (end 4 -0.8) (layer Dwgs.User) (width 0.1) (tstamp 359842bd-fdc2-49ce-b00a-7b3e54d86433))

-  (pad "1" smd rect (at -5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 12024ca0-a888-4036-921f-8657915c8cf7))

-  (pad "2" smd rect (at -2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp b5c5bab1-2304-4bfb-9fb9-5b69e089a6da))

-  (pad "3" smd rect (at 0 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp b531084b-ceeb-440d-92ab-054bbd6691cf))

-  (pad "4" smd rect (at 2.5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp bb5c12ce-122a-4092-ba6f-3e885778f59a))

-  (pad "5" smd rect (at 5 1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 01931259-c2ba-4ffe-a768-d7193d230d8e))

-  (pad "6" smd rect (at 5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 95cb22b7-1009-44ec-b1dd-771b02ab6b62))

-  (pad "7" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp f6fd7823-c3ff-485c-a772-000ab18943d0))

-  (pad "8" smd rect (at 0 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 57c0d6a8-e5ef-4c56-9d5a-f704e5c4e86e))

-  (pad "9" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 9a86bfe7-1a5f-4a09-b9b8-2d929c099fac))

-  (pad "10" smd rect (at -5 -1.8) (size 1.8 3) (layers "F.Cu" "F.Mask") (tstamp 3c032d74-b7de-4282-a2b2-c52220676b22))

-  (pad "11" smd rect (at -2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")

-    (solder_mask_margin 0.1) (tstamp 42375fec-6afc-42ca-8309-a864bc9d538f))

-  (pad "12" smd rect (at 0 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")

-    (solder_mask_margin 0.1) (tstamp e49e85f2-9635-403d-bc26-0ee11d04fbc3))

-  (pad "13" smd rect (at 2.5 1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")

-    (solder_mask_margin 0.1) (tstamp 2fa89724-9137-475a-8ceb-e512ba588fac))

-  (pad "14" smd rect (at 2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")

-    (solder_mask_margin 0.1) (tstamp 5d946dff-9fad-4f23-9678-a7ebcb324dd5))

-  (pad "15" smd rect (at 0 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")

-    (solder_mask_margin 0.1) (tstamp 073ac2d9-5dd5-479a-897f-a9bc82e2e0fc))

-  (pad "16" smd rect (at -2.5 -1.8) (size 1.8 3) (layers "B.Cu" "B.Mask")

-    (solder_mask_margin 0.1) (tstamp 72e97175-583e-4674-a4e9-a3254bc65a96))

-)